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Thermal conductive adhesive

specifications

Choose type: Silicone Epoxy
Feature Unit Options
Curing method -
Appearance Visual
Viscosity cPc
Transmittance (W/m/k)
Volume resistivity Ohm cm 1×10^(−4) (𝐶𝑜𝑛𝑑𝑢𝑐𝑡𝑖𝑣𝑒) ~ 1×10^14 (𝐼𝑛𝑠𝑢𝑙𝑎𝑡𝑖𝑜𝑛)
Hardness Shore
Common adherable substrates -

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