Addition curing systems require the mixture of a silicone polymer with a catalyst to initiate curing. Although addition cured systems begin to cure while at room temperature, the sealant contains an inhibitor which increases the temperature resistance, thus adding heat will accelerate the curing process.

Adhesives can come as either one-part or two-part. One part adhesives start curing from the outside surface and gradually move to the inside. Two-part adhesives need to be mixed according to their mix ratio, and cure on the surface and internally simultaneously.

The time it takes for a bead of sealant to cure to the point that the surface of sealant is no longer sticky when touched.

Under regular working conditions, working time refers to the time it takes the viscosity to double.

RoHS is short for the?Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment [DIRECTIVE (EU) 2015/863 published 2015/03/31]. The directive restricts the use of Lead (Pb), Mercury (Hg), Cadmium (Cd), Hexavalent chromium (Cr6+), Polybrominated biphenyls (PBB), Polybrominated diphenyl ether (PBDE), Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP) and Diisobutyl phthalate (DIBP).

Silicone releases tiny siloxane molecules during curing. Siloxane may cause contact failure to electronic components of products with sealed housing, such as micro relays, micro switches and micro motors, which may shorten the life of these electronic products. Low molecular weight refers to the process of reducing volatile siloxane. Vacuum distillation is used to distill and remove the siloxane impurities from silicone adhesive, and these adhesives with reduced volatile siloxane can prolong the life of sensitive electric components.

Catalyst poisoning refers to the partial or total deactivation of acatalyst caused by exposure to a range of chemical compounds. These substances include lead (Pb), phosphorus (P), Nitrogen (N), Sulfur (S), Arsenic (As), Mercury (Hg), Bismuth (Bi) and Tin (Sn). Deactivation causes the catalyst not to react with the curing agent and prevents the adhesive from fully curing.